Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
1～10 item / All 10 items
Examples of flexible substrate processing using materials such as polyimide and liquid crystal polymers.
In the processing of polyimide and liquid crystal polymer materials, we achieve high-quality drilling by using a Gaussian beam with a minimum spot diameter of φ10μm for copper foil removal processing and a top-hat beam for resin processing.
Examples of router processing applications for various substrate materials.
Using our UV laser processing machine for high-speed routing, we achieve high-quality contour processing, cavity processing, singulation processing, and engraving processing for various substrates. This document includes examples of routing processing for multilayer boards of Cu/PP, double-sided boards of Cu/LCP, flexible substrates, and FR-4, among others.
Introduction of various processing examples of picosecond UV laser processing machines.
When high-quality processing is required for glass materials, printed circuit board materials, semiconductor-related materials, and others that are difficult to process in nanoseconds while minimizing thermal effects, using picosecond or femtosecond laser processing machines is effective. We have published examples of processing various materials with our picosecond UV laser machine.
Delicately, swiftly. High-performance UV laser processing.
RSD-SUNMAX-UVZH/UV Laser Marking Crystal engraving, which was previously impossible, is now possible. In addition to crystal, a wide range of materials can also be processed. High-speed laser processing is possible, and standard processing can be completed in just a few seconds. The marking area is 100mm square. It is a compact tabletop model, making it suitable for installation in offices, and it requires very little maintenance.
FPC roll substrate compatible UV laser driller
The "UV Laser Driller" is equipped with a new scanner that reduces processing time. Additionally, the power has been increased from 20W to 30W, enhancing the processing speed. <Product Features> - Reduced processing time compared to conventional products - High positional accuracy (±15μ) - Adoption of high-power laser (30W) *For more details, please download the PDF or contact us.
Processing small diameter holes in printed circuit boards with UV laser! A variety of laser marking options.
The UV laser processing machine "UV Deiller" is a device that processes small-diameter holes in printed circuit boards using UV lasers. We offer a variety of types, including "EMC Laser Marking" applicable to four vacuum tables and "Substrate Marking" compatible with various types of PKG substrates. 【Product Lineup】 ■EMC Laser Marking ■Substrate Marking ■2D barcode marking ■Wafer Marking *For more details, please refer to the PDF document or feel free to contact us.
Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.
The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.
Examples of UV laser processing applications for various materials.
Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.
Examples of micro-diameter hole processing for package substrates
Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.
